e-Xstream offers consumer electronics the technology and industry expertise they need to reduce the development cycle of composite parts and materials by enabling accurate virtual prototyping.
From the build-up of circuit bords, packaging, up to the mass production of housing, many challenges in the electronics industry are today tackled by using and combining a vast mix of different materials. The final designs must withstand severe conditions, ranging from mechanical loads to temperature cycling.
The design cycle of consumer products like mobile phones, flat screen TVs, etc. is extremely short and relies heavily on advanced material performances to achieve smaller and thinner products with nice esthetic and mechanical properties. An efficient design process will thus rely on a predictive set of numerical simulation tools in which Digimat plays a major role.Solution
Digimat offers predictive material models as an answer to these challenges. It is a unique and fully integrated approach allowing geometry, material and process to become interconnected design variables.
Digimat is used by the industry to bridge the gap between injection molding simulation and structural FEA of glass fiber reinforced plastics.Benefits
- Reduce development time
- Optimize material use
…From REACH legislation to unexpected fluctuations in raw material price levels, our products are challenged more than ever. In this context DIGIMAT offers the perfect combination of material modeling platform to optimize the performance of our reinforced thermoplastic components and has demonstrated its ability to provide robust and accurate prediction of our materials behavior."Digimat is strongly coupled to:-M. Oubahmane, Innovation & Technology Specialist Schneider Electric
- Major nonlinear FEA software (Nastran, Marc, Abaqus, ANSYS, LS-DYNA, PAM-CRASH and SAMCEF)
- Injection Molding software (Moldflow, SigmaSoft, Moldex3, REM3D)
- Physics: mechanical performance, electrical conductivity, thermal conductivity
- Materials: injected plastics, nanocomposites, woven, continuous fibers
- Stiffness (torsional, bending)
- Drop test (Failure)
- Fatigue resistance
- Low warpage
- Esthetic (Soft feel, surface finish)
- Thermal conductivity
- Electrical conductivity